Refractory Metallization

Hi-Temp Refractory metallization is the only solution for some packaging applications. Tungsten and Moly-Manganese metallizations have higher adhesion to the substrate than Thick-film metallization. This makes it the ideal process for Hermetic packages, Brazed lead frames and packages requiring high operating temperatures. We can screen print, spray or hand paint these metals onto Alumina Oxide or Beryllium Oxide substrates. These patterns can be plated with Gold and Nickel or Gold alone. Once Gold plated these surfaces are solderable and wire bondable with Aluminum or Gold wire.